Skip to content
Search By: Close Search Selector
Home > PolySwitch Devices > Surface-mount

PolySwitch Surface-mount Resettable Devices

When you are designing a board with limited space, but need to build in reliable resettable circuit protection, PolySwitch surface-mount products can help. With continued miniaturization and increased functionality of electronic products we understand your need for smaller more robust circuit protection that will help you meet the increasingly stringent agency requirements. We offer the widest variety of PPTC surface-mount devices in the industry with our Raychem Circuit Protection surface-mount line. We now offer automotive specific surface-mount devices (miniSMD, nanoSMD, AHS, and ASMD devices) that have been tested to the AECQ200 standard. See the PolySwitch Automotive Devices section for more information.

femtoSMDC Device Datasheet (pdf 191KB)
Surface-mount Family Datasheet (pdf 440KB)
Tech Fundamentals (pdf 93KB)

Product Series RoHS Compliant picoSMD microSMD nanoSMD* miniSMD* decaSMD
Construction: Surface-mount Surface-
mount
Surface-
mount
Surface-
mount
Surface-mount
Form Factor (mils) 0805 1210 1206 1812 2018
Form Factor (mm) 2012 3225 3216 4532 5050
IH Hold Current (A) 0.35 0.05 to 2.00 0.12 to 1.5 0.14 to 2.6 0.55
IT Trip Current (A) 0.75 0.15 to 4.00 0.39 to 3.00 0.28 to 5.00 1.10
VMax Operating Voltage (VDC) 6 6 to 30 6 to 48 6 to 60 60
IMax(A) 20 10 to 100 10 to 100 10 to 100 10
RMin (Ω) 0.42Ω 0.02Ω to 3.60Ω 0.04Ω to 1.40Ω 0.015Ω to 1.50Ω 0.40Ω
R1 Max (Post Trip)** 1.40Ω 0.06Ω to 50.00Ω 0.11Ω to 6.50Ω 0.043Ω to 6.00Ω 1.10Ω
Max Operating Temperature 85°C 85°C 85°C 85°C 85°C

 


Product Series RoHS Compliant SMD SMDH AHS ASMD
Construction: Surface-
mount
Surface-
mount
Surface-
mount
Surface-
mount
Form Factor (mils) 2018 to 3425 2920 to 3425 2018 to 3425 2920 to 3425
Form Factor (mm) 5050 to 8763 7555 to 8763 5050 to 8763 7555 to 8763
IH at 20°C (A) 0.3A to 3.00 1.20 to 1.60 0.80 to 3.00 0.23 to 1.97
IT at 20°C (A) 0.60 to 6.00 2.30 to 3.20 2.00 to 6.00 0.59 to 5.00
VMax Operating Voltage (VDC) 6 to 60 16 16 16 to 60
IMax (A) 10 to 40 50 to 70 70 10 to 40
RMin (Ω) 0.015Ω to 1.20Ω 0.05Ω to 0.15Ω 0.024Ω to 0.13Ω 0.035Ω to 0.98Ω
R1 Max (Post Trip)** 0.048Ω to 4.80Ω 0.15Ω to 0.34Ω 0.083Ω to 0.55Ω 0.085Ω to 4.80Ω
Max Operating Temperature 85°C 125°C 125°C 85°C

* Devices tested to the AECQ200 standard
** * Maximum resistance is measured 1 hour after reflow
RoHS Compliant RoHS Compliant

Part Numbering System for PolySwitch Surface-mount Devices
Part Numbering System for PolySwitch Surface-mount Devices

Agency Recognition for PolySwitch Surface-mount Devices
Standard Parts File Number
UL all PolySwitch surface-mount devices E74889
CSA all PolySwitch surface-mount devices CA78165
TÜV microSMD and miniSMD series R72041438
TÜV nanoSMD series R72041439
TÜV SMD series R72041427
TÜV decaSMD series R72090019
TÜV SMDH series R72072048
TÜV picoSMD series R72072068

 

Solder Reflow and Rework Recommendations for PolySwitch Surface-mount Devices
Recommended reflow methods:
•IR
•Hot air
•Nitrogen
Recommended maximum paste thickness: 0.25mm (0.010 inch)
Recommendations:
Devices can be cleaned using standard methods and aqueous solvents.
Tyco Electronics believes that the optimum conditions for forming acceptable solder fillets occur when a reasonable amount of solder paste is placed underneath each device's termination. As such, Tyco Electronics requests that customers comply with our recommended solder pad layouts.
Customer should validate that the solder paste amount and reflow recommendations meet the application.
Tyco Electronics requests that customer board layouts refrain from placing raised features (e.g. vias, nomenclature, traces, etc.) underneath PolySwitch devices. It is possible that raised features could negatively impact solderability performance of our devices.
Rework
• picoSMD, nanoSMD, microSMD and miniSMD series: standard industry practices . Please also avoid direct contact to the device.
•SMD series: rework should be confined to removal of the installed product and replacement with a fresh device.

 

Classification Reflow Profiles
Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly
Average Ramp-Up Rate (Tsmax to Tp) 3 °C/second max. 3° C/second max.
Preheat
• Temperature Min (Tsmin) 100 °C 150 °C
• Temperature Max (Tsmax) 150 °C 200 °C
• Time (tsmin to tsmax) 30-70 seconds 30-70 seconds
Time maintained above:
• Temperature (TL) 183 °C 217 °C
• Time (tL) 60-150 seconds 60-150 seconds
Peak/Classification Temperature (Tp) 240 °C 260 °C
Time within 5 °C of actual Peak
Temperature (tp) 10-30 seconds 20-40 seconds
Ramp-Down Rate 6 °C/second max. 6 °C/second max.
Time 25 °C to Peak Temperature 6 minutes max. 8 minutes max.

Note: All temperatures refer to topside of the package, measured on the package body surface.
Solder Reflow Profile for PolySwitch Surface-mount Devices

WARNING
  • Operation beyond the maximum ratings or improper use may result in device damage and possible electrical arcing and flame.
  • The devices are intended for protection against occasional overcurrent or overtemperature fault conditions and should not be used when repeated fault conditions or prolonged trip events are anticipated.
  • Contamination of the PPTC material with certain silicon based oils or some aggressive solvents can adversely impact the performance of the devices.
  • Device performance can be impacted negatively if devices are handled in a manner inconsistent with recommended electronic, thermal, and mechanical procedures for electronic components.
  • Operation in circuits with a large inductance can generate a circuit voltage (L di/dt) above the rated voltage of the PolySwitch resettable device.